MediaTek, the Taiwanese cell chipmaker, on Monday introduced the Dimensity 1050 system-on-chip (SoC) as its newest mannequin within the Dimensity portfolio. The new chip is the corporate’s first providing to help millimetre-wave (mmWave) 5G connectivity alongside the extensively adopted sub-6GHz frequency. The addition of mmWave 5G to the Dimensity 1050 SoC has enabled MediaTek to make the competitors harder for Qualcomm that already has its Snapdragon platforms with help for a similar mobile community know-how. MediaTek additionally introduced the Dimensity 930 and Helio G99 as two different chips for the next-generation smartphones.
Based on the TSMC 6nm course of know-how, the MediaTek Dimensity 1050 SoC carries an octa-core CPU. The chip helps 3CC provider aggregation on sub-6GHz (FR1) spectrum and 4CC provider aggregation on mmWave (FR2) spectrum. The firm claims that the Dimensity 1050 is able to delivering as much as 53 p.c quicker speeds and higher attain to smartphones over the LTE + mmWave aggregation.
The presence of mmWave 5G help on the Dimensity 1050 will assist present higher connectivity in smaller, densely populated areas.
MediaTek has built-in two ARM Cortex-A78 CPUs with speeds reaching 2.5GHz and the ARM Mali-G610 graphics processing unit with the brand new Dimensity SoC. There can be help for Wi-Fi optimisations and Wi-Fi 6E help together with 2×2 MIMO antenna in addition to MediaTek’s HyperEngine 5.0 gaming know-how to help lower-latency connections with the brand new triband — 2.4GHz, 5GHz, and 6GHz frequency. The chip additionally contains help for UFS 3.1 storage and LPDDR5 reminiscence.
The Dimensity 1050 SoC helps 144Hz full-HD+ shows, together with MediaTek’s Miravision 760 video enhancement know-how. The chip is able to delivering simultaneous streams by way of the entrance and rear cameras of the system utilizing a twin HDR video seize engine. Further, there’s MediaTek’s APU 550 to help synthetic intelligence (AI) based mostly digicam actions. The firm additionally claims that there’s an enhanced noise discount for low-light pictures.
In addition to the Dimensity 1050 SoC, MediaTek unveiled the Dimensity 930 as its new 5G chip to help combined duplex FDD+TDD for quick connectivity. The chip additionally contains help for 120Hz full-HD+ shows together with MiraVision HDR video playback help and HDR10+ video. Additionally, there are HyperEngine 3.0 Lite gaming enhancements which might be touted to allow decrease latency and an enhanced battery life.
The firm additionally launched the MediaTek Helio G99 as an improve to the Helio G96. The new 4G chip is claimed to ship greater than 30 p.c energy financial savings for gaming over the earlier Helio mannequin.
On the supply half, smartphones based mostly on the Dimensity 1050 and Helio G99 will probably be out there within the third quarter, whereas the Dimensity 930 will debut within the international markets within the second quarter, MediaTek stated.